HCAT
Product
AlN Wafer
AlN Raw Materials
Spare parts of AlN Semiconductor equipment
SiC Raw Materials
Spare parts of SiC Semiconductor equipment
Si3N4 Raw Materials
Spare parts of Si3N4 Semiconductor equipment
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AlN Raw Materials
AlN Raw Materials
1
AlN Raw Materials
Product Features
High thermal conductivity
Non-toxic
Good corrosion and high temperature resistance
Thermal stability
Application
Equipment fo
r Semiconductor Fabrication
Industrial Machinery
Spare Part with Hi-Temp Resistance and Anticorrosion
Specification
×
規格表
Item / Unit
AlN
Block
Thickness
mm
2 ~ 30
Size
mm
>450
Color
-
Beige-Gray
Sape
-
Rotundity
Through
hole
mm
-
Bulk
density
g/cm3
3.4
Surface
roughness
µm
-
Mechanical
characteristic
3-point
bending strength
MPa
-
Young's
modulus
GPa
-
Vickers
hardness
GPa
-
Breakdown
Strength
kV/mm
-
Thermal
characteristic
Coefficient
of thermal expansion
40-400℃
×10-6/K
4.8
40-800℃
×10-6/K
5.4
Thermal
conductivity
25℃
W/(m・K)
180
200
230
Specific
heat
J/(kg・K)
720
Electric
characteristic
Dielectric constant
1MHz
-
9
Dielectric
Loss
1MHz
×10-4
3
Volume
resistivity
25℃
Ω・cm
>10
14
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