HCAT
Product
AlN Wafer
AlN Raw Materials
Spare parts of AlN Semiconductor equipment
SiC Raw Materials
Spare parts of SiC Semiconductor equipment
Si3N4 Raw Materials
Spare parts of Si3N4 Semiconductor equipment
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SiC Raw Materials
SiC Raw Materials
1
SiC Raw Materials
Product Features
Low on-state resistance
Ion resistance
High temperature and pressure resistance
Good thermal conductivity and stability
Application
Equipment fo
r Semiconductor Fabrication
Industrial Machinery
Spare Part with Hi-Temp Resistance and Anticorrosion
Specification
×
碳化矽塊材規格表
(表格內容可透過左右拖移
)
Item / Unit
SiC
Block
Thickness
µm
100 ~ 2000
100 ~ 2000
100 ~ 2000
Size
inch
Ф6"
Ф8"
Ф12"
Color
-
Carbon-black
Carbon-black
Carbon-black
Sape
-
Rotundity
Rotundity
Rotundity
Through
hole
mm
-
-
-
Bulk
density
g/cm3
3.2
3.2
3.2
Surface
roughness
µm
-
-
-
Mechanical
characteristic
3-point
bending strength
MPa
400
400
400
Young's
modulus
GPa
400
400
400
Vickers
hardness
GPa
-
-
-
Breakdown
Strength
kV/mm
-
-
-
Thermal
characteristic
Coefficient
of thermal expansion
40-400℃
×10-6/K
3.9
3.9
3.9
40-800℃
×10-6/K
4.3
4.3
4.3
Thermal
conductivity
25℃
W/(m・K)
130
130
130
Specific
heat
J/(kg・K)
-
-
-
Electric
characteristic
Dielectric constant
1MHz
-
-
-
-
Dielectric
Loss
1MHz
×10-4
-
-
-
Volume
resistivity
25℃
Ω・cm
>3x10
8
>3x10
8
>3x10
8
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