HCAT
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AlN Wafer
AlN Raw Materials
Spare parts of AlN Semiconductor equipment
SiC Raw Materials
Spare parts of SiC Semiconductor equipment
Si3N4 Raw Materials
Spare parts of Si3N4 Semiconductor equipment
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Si3N4 Raw Materials
Si3N4 Raw Materials
1
Si
3
N
4
Raw Materials
Product Features
Low on-state resistance
Spare Part with Hi-Temp Resistance
Hi-Temp Resistance, Anticorrosion, and Impact resistance
Good stability
Application
Equipment fo
r Semiconductor Fabrication
Industrial Machinery
Spare Part with Hi-Temp Resistance, Anticorrosion, and Impact resistance
Specification
×
氮化矽塊材規格表
(表格內容可透過左右拖移
)
Item / Unit
Si
3
N
4
Color
-
Beige-Gray
Sape
-
Rotundity
Bulk
density
g/cm3
3.25
Surface
roughness
µm
<0.5
Mechanical
characteristic
3-point
bending strength
MPa
785
Young's
modulus
GPa
295
Vickers
hardness
GPa
15
Fracture toughness
MPa‧m
1/2
6.5
Thermal
characteristic
Coefficient
of thermal expansion
40-400℃
×10-6/K
2.8
40-800℃
×10-6/K
3.1
Thermal
conductivity
25℃
W/(m・K)
80
Specific
heat
J/(kg・K)
680
Electric
characteristic
Dielectric constant
1MHz
-
8
Volume
resistivity
25℃
Ω・cm
>10
14
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